European Comission Seventh Research Framework Programme (FP7) -ICT Project

Welcome to the silicon photonic world of "BOOM"

Terabit-on-chip:
Micro and Nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers

BOOM is an integration project that aims to pursue the systematic advancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks.

  "Mobile light Version"

Consortium

The BOOM consortium consists of highly-skilled organizations with a proven track record in the field of photonic integration. Specifically BOOM involves: two European SMEs (AMO, LioniX), one major telecom operator (TILAB), three European universities (ICCS/NTUA, TU Berlin, TU/e) and three top European research centers (HHI, IMEC, IHP).
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Objectives

BOOM aims to develop a new generation of silicon photonic components including the first SOI wavelength converters, EML transmitters, WDM photodetectors and μ-ring-based wavelength cross-connects. The components will be used to build the first silicon photonic Tb/s router.

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News

[June 2010]:2nd Annual Review

Meeting

[September 2010]:ECOC'10 Booth

Under ICT-EUROFOS project

[February 2011]: Invited Talk

ONDM'11, Bologna, Italy

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